Microwave power circuit with an active device mounted on a heat dissipating substrate
AssigneeRCA Corporation
InventorFranco N. Sechi
Life of this patent
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Abstract
A microwave power circuit includes a thermally conductive, electrically insulating substrate such as beryllium oxide which has a relatively rough surface, a layer of dielectric material such as glass on a portion of the rough surface which layer has a relatively smooth surface, a conductive material on the relatively smooth surface, and a heat dissipating amplifying device having at least two terminals, one of which is connected to the conductive material and one of which is thermally connected to the substrate in a manner to pass heat thereto.
Claims8
A microwave power amplifier circuit comprising in combination:
- a substrate of the type which is substantially electrically insulative and provides a relatively high thermal conductivity and which has an undesirably relatively rough surface;
- a dielectric layer of material directly in contact with said relatively rough surface forming a relatively smooth surface;
- a conductive material disposed in a predetermined pattern on said dielectric layer;
- and
- a heat generating amplifying device having at least two electrodes, one of which is connected to said conductive material and another of which is thermally connected to said substrate to pass heat thereto.
A method of constructing a microwave power circuit which includes a heat generating amplifying device having at least two electrodes, comprising the steps of:
- a. providing an electrically insulating, thermally conductive substrate having a relatively rough surface;
- b. applying a layer of electrically insulating material directly on less than all of said rough surface, which layer forms a relatively smooth surface;
- c. applying a conductive layer over said electrically insulating layer;
- d. removing portions of said conductive layer to thereby leave a conductive pattern, said conductive pattern including at least a passive electronic component;
- and
- e. connecting one of said electrodes to said conductive layer and thermally connecting another of said electrodes to said substrate where said electrically insulating layer is not present.
Dependencies are inferred from the claim text.