Copper foil for a printed circuit and a method for the production thereof
AssigneeFurukawa Circuit Foil Co., Ltd.
InventorHiroshi Nakatsugawa
Life of this patent
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Abstract
A copper foil for a printed circuit comprising a copper layer having the bonding surface coated with a tin layer and having said tin layer coated with a vanadium-containing zinc layer which optionally may be given a chromic acid treatment. The invention also provides a method for producing said copper foil.
Claims17
Copper foil for a printed circuit having a bonding surface which will subsequently be bonded to a resin substrate, which comprises a copper layer, a layer consisting essentially of tin coated on said bonding surface of said copper layer and a layer consisting essentially of vanadium-containing zinc coated on said tin layer.
A method for producing copper foil for a printed circuit having a bonding surface which will subsequently be bonded to a resin substrate, which comprises coating a tin layer on at least one side of a copper layer by electroplating and coating a vanadium-containing zinc layer on said tin layer by electroplating.
Dependencies are inferred from the claim text.