Microelectronic device
AssigneeWestern Electric Company, Inc.
InventorsDaniel A. Di Leo, Samuel E. Kurtz, John J. Svitak
Life of this patent
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Abstract
A method of bonding microelectronic components (10, 23, 24) is disclosed. A light emitting diode (10) is bonded to a conductive lead (24) and/or a portion of a lead frame (23) using an adhesive having no metallic particles therein. The diode (10) is clamped to the conductive lead (24) and/or the lead frame (23) as the epoxy is cured. Such bonds have been found to exhibit low contact resistance in addition to long life and reliability.
Claims6
A light emitting diode assembly comprising:
- a light emitting diode having a thin coating of a noble metal deposited on a portion thereof;
- at least one electrically conductive lead having a thin coating of a noble metal deposited thereon;
- and
- an unfilled epoxy connecting the noble metal coated portion of the light emitting diode to the noble metal coating of the electrically conductive lead.
A microelectronic device having first and second electrically conductive sections, the device further comprising:
- a thin coating of a noble metal on at least a portion of each of the sections;
- and
- an unfilled adhesive bonding the coated conductive sections to form a mechanical and electrical conductive connection therebetween.
An improved semiconductor array comprising at least one semiconductor device and an opposed lead member, wherein the improvement comprises an improved means of mechanically and electrically interconnecting the device to the member, said interconnecting means consisting essentially of:
- (a) a noble metal contact on a surface of a device;
- (b) a noble metal contact on a facing surface of the member;
- and
- (c) an unfilled adhesive intermediate the noble metal contacts of the device and the member.
Dependencies are inferred from the claim text.