Bath and process for the electrodeposition of ruthenium
AssigneeOccidental Chemical Corporation
InventorsKenneth D. Baker, Yvonne Rymwid
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Abstract
Improved baths for the electrodeposition of ruthenium metal on various substrates. The ruthenium metal baths are formulated with a complex of ruthenium metal and sulphamic acid wherein the molar ratio is one mole of ruthenium metal and from about 4 to 10 moles of sulphamic acid. For most purposes, certain selective metals are also present in the baths, which are maintained at a pH ranging from about 1.0 to 2.2. The process for utilizing said baths to plate substrates with essentially pure ruthenium metal is also described and claimed.
Claims13
An aqueous electroplating bath for depositing ruthenium metal on various substrates which comprises a complex of ruthenium and sulphamic acid which contains from four to ten moles of sulphamic acid per mole of ruthenium, which complex is present in amount at least sufficient to deposit ruthenium on the substrate to be plated up to the maximum solubility of the complex in the bath;
- and a second metal component selected from nickel, cobalt, iron, tin, lead and magnesium, which second metal is present in the bath in amounts sufficient to produce a crack-free ruthenium metal deposit;
- said bath having a pH of from about 0.1 to 2.4.
Dependencies are inferred from the claim text.