Soldering method for electric and or electronic component
AssigneeAiwa Co., Ltd.
InventorKatsuhiko Tsuchikura
Life of this patent
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Abstract
A soldering method comprises forming bubbles by blowing gas into a pool of molten solder, and striking the bubbles against a printed circuit board with electric and or electronic components temporarily fixed thereto to solder them to each other.
Claims3
A soldering method comprising conveying printed circuit boards with electric and or electronic components temporarily fixed thereto along the top of a pool of molten solder, generating bubbles by blowing gas into the molten solder, the bubbles rapidly rising in the molten solder toward its top and striking the rising bubbles against components and the board to achieve soldering of the components to the board.
Dependencies are inferred from the claim text.