Method for encapsulating components with cases and an encapsulation provided by the method
AssigneeSiemens Aktiengesellschaft
InventorJoachim Dathe
Life of this patent
Estimating the term…
Abstract
Method for encapsulating components in cases, which includes connecting a gold wire to an aluminum surface, subsequently closing the case by welding in a vacuum, and tempering the case in a hydrogen-containing atmosphere and an encapsulation produced by the method.
Claims12
Encapsulation for a semiconductor component, comprising a base plate, a case with a low hydrogen permeability at the maximal temperature permitted for the component, said case being vacuum-welded to said base plate closing off said base plate and tempered in a hydrogen-containing atmosphere, a hydrogen atmosphere disposed in said case after tempering, a raised portion integral with said base plate inside said case, a plurality of lead-in lines passing through holes formed in said base plate and raised portion, glass beads disposed between said lead-in lines and said base plate and raised portion in said holes, and gold wires connected from said lead in lines to aluminum surfaces of the component in said case before said case is closed.
Method for encapsulating components in cases while preventing or reducing intermetallic gold-aluminum phases in semiconductor components, which comprises connecting a gold wire to an aluminum surface of a semiconductor component, subsequently closing the case by welding in a vacuum, and tempering the case in a hydrogen-containing atmosphere after welding, to develope a hydrogen atmosphere in the case by diffusion.
Dependencies are inferred from the claim text.