Composite diamond compact for a wire drawing die and a process for the production of the same
AssigneeSumitomo Electric Industry, Ltd.
InventorsAkio Hara, Shuji Yazu
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Abstract
The present invention relates to a composite diamond compact for a wire drawing die, in which a part or all of the circumference of a diamond sintered body is surrounded by a cermet consisting of a hard compound of (Mo, W)C type carbide crystals containing molybdenum as a predominant component, bonded by an iron group metal, and the binder phase of the diamond sintered body contains an iron group metal and fine carbide crystals containing molybdenum as a predominant component.
Claims29
A diamond compact in cylindrical form for a wire drawing die, in which a part or all of the circumference of a diamond sintered body is surrounded by a cermet consisting of a hard compound of (Mo, W)C type carbide crystals containing molybdenum as a predominant component, bonded by an iron group metal, and wherein the binder phase of the diamond sintered body contains an iron group metal and fine carbide crystals containing molybdenum as a predominant component.
A process for the production of a diamond compact for a wire drawing die, which comprises filling a sintered ring-shaped cermet consisting of carbide crystals in the form of (Mo, W)C containing molybdenum as a predominant component, bonded by an iron group metal, with diamond powder, subjecting the diamond powder to high pressure sintering at a temperature and pressure at which diamond is stable and bonding the diamond sintered body coherently to the cermet.
Dependencies are inferred from the claim text.