US 4,374,708 AGranted

Fine line circuitry probes and method of manufacture

AssigneeGeneral Dynamics, Pomona Division

InventorWilliam P. Dugan

Life of this patent

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Abstract

Probes for testing circuitry comprising plural oriented, circular cross-section, microcircuit probes positioned in a dielectric base and having connections on the opposite side of base to attach probe circuitry. A method of manufacture of such probes includes assembling a laminate of a dielectric base, and an aluminum mandrel, drilling holes in the laminate at positions corresponding to the eventual probe positions, electroless plating the entire package, passivating the electroless plated coating, plating the entire assemblage until the holes are substantially filled with plating, separating and shearing off the layers of plating from the laminate, applying a photoresist and developing it on the aluminum side corresponding to the holes for the probes, and on the opposite side corresponding to the desired circuitry, removing the material on the aluminum side to expose the aluminum, dissolving the aluminum to expose the probes, and soldering and reflowing the solder on the probes.

Claims3

Dependent claims

A method of producing a microcircuit probe containing testing board comprising;

laminating and adhering together a board and a dielectric layer with a mandrel sandwiched between them, said mandrel being a thickness equivalent to the desired probe height;
providing a plurality of holes through said board, mandrel and layer for locating said probes;
cladding said board, said layer and said holes with a conductive metal;
electroplating the structure with the metal which is to constitute said probes to form thick-walled cylinders of said metal in said holes;
removing plated metal from the exterior surfaces of the structure while leaving the metal in said holes;
masking the surface of said board in a selected circuit pattern;
etching the unmasked portions of said board to remove exposed cladding;
removing said mask and exposing the remaining cladding;
removing all material, including the dielectric layer, along the surface of the mandrel remote from the board;
removing said mandrel without disturbing the probe metal or the board;
and
providing a solder surface on the probes produced thereby.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 06/279,888Filed 2 Jul 1981 · division
Priority: 28 Feb 1980
Granted: 22 Feb 1983
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H05K 3/4092
Forming printed elements for providing electric connections to or between printed circuits: integral conductive tabs, i.e. conductive parts partly…
G01R 1/06744
Geometry aspects: microprobes, i.e. having dimensions as IC details
H05K 3/42
Forming printed elements for providing electric connections to or between printed circuits: plated through-holes or plated via connections
H05K 2201/0367
Conductor shape: metallic bump or raised conductor not used as solder bump