Devices and method for delivery of solder and brazing material

Abstract

A soldering device having a guide body for receiving and delivering a filler metal to form a weldment. The guide body has an end portion which is positioned in the path of the heat from the burner to preheat the filler metal therein. The temperature of the filler metal in the end portion is sensed by a thermocouple and delivered to a memory unit for comparison with a preset temperature for operating a device for feeding the filler metal to the end portion. A cooling area upstream from the end portion having collant circulating therethrough is also controlled from the memory unit. A screen movable between the burner and the end portion to control the flow of heat to the latter is also controlled by the memory unit. The temperature of the burner flame and of the workpiece can also be sensed to assure proper working conditions upon delivery of the filler metal. Additionally, the burner and the feed of a reducing gas can be automatically terminated while changing workpieces.

Dependencies are inferred from the claim text.