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AssigneeTokyo Denki Kagaku Kogyo Kabushiki Kaisha
InventorsKotaro Harigane, Kenichi Takahashi, Hirokazu Shudo, Shuichi Tando
Estimating the term…
Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be connected intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.
Apparatus for mounting chip type circuit elements on printed circuit boards, comprising:
Apparatus for positioning a chip type circuit element comprising a first claw having a first notch formed therein defining a substantially orthogonal apex portion, and a second claw having a second notch formed therein defining a substantially orthogonal apex portion, said first and second claws being movably mounted such that said apex portions of said first and second claws are in mutually opposed relationship and situated along a line passing through diagonal corners of a chip type circuit element which is positioned at a desired position.
A pallet for transferring chip type circuit elements including an adhesive mat constituting an upwardly facing surface for carrying said chip type circuit elements, and a plurality of lifting pins mounted for reciprocating movement between a lower position wherein an upper end thereof does not project above the surface of said mat and an upper position wherein said upper end projects above the surface of said adhesive mat.
Dependencies are inferred from the claim text.