Peelable bonded structures and process for preparing same
AssigneeToyo Seikan Kaisha, Ltd.
InventorsIsao Ichinose, Fumio Mori, Noboru Suzuki
Life of this patent
Estimating the term…
Loading patent…
AssigneeToyo Seikan Kaisha, Ltd.
InventorsIsao Ichinose, Fumio Mori, Noboru Suzuki
Estimating the term…
A peelable bonded structure having a peel strength of 0.05 to 5 kg/cm comprises a plurality of articles, at least one of which is made of metal, bonded together through a composite coating layer. The composite coating layer is composed of adjacent first and second coating layers at least one of which comprises (A) a modified olefin resin having a carbonyl group concentration of 0.01 to 200 milliequivalents per 100 g of the olefin resin and (B) a coating film-forming base resin at an (A)/(B) weight ratio of from 0.2/99.8 to 40/60 and has a multi-layer distribution structure having resin concentration gradients in the thickness direction such that the modified olefin resin (A) is distributed predominantly in the portion contiguous to the interface between the two coating layers and the base resin (B) is distributed predominantly in the opposite portion.
A process for preparing peelable bonded structures comprising a first article composed of metal and a second article bonded to the first article through a composite coating layer, said process comprising:
A process for preparing peelable bonded structures comprising a first article composed of metal and a second article bonded to the first article through a composite coating layer, said process comprising:
Dependencies are inferred from the claim text.