Level conversion circuit
AssigneesHitachi, Ltd., Hitachi Ome Electronic Co., Ltd.
InventorsNobuaki Kitamura, Kouji Masuda, Masao Mizukami
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AssigneesHitachi, Ltd., Hitachi Ome Electronic Co., Ltd.
InventorsNobuaki Kitamura, Kouji Masuda, Masao Mizukami
Estimating the term…
The collectors of differential pair transistors having their emitters connected to each other are connected to a positive power source voltage via respective load resistors. The emitters are connected to a negative power source voltage via a current source transistor. The base bias voltage of the current source transistor is supplied from a bias circuit operating on the difference voltage between the positive power source voltage and the negative power source voltage. When the positive power source voltage drops, the base bias voltage of the current source transistor drops in response thereto. Hence, the value of a current flowing through the current source transistor decreases. Due to this decrease of the current, the voltage drop of the load resistors decreases, thereby off-setting a low level potential of the collector output signals of the differential pair transistors. Thus, the differential pair transistors are prevented from being driven into saturation.
A level conversion circuit for deriving an output signal having a positive level from an input signal having a negative level comprising:
The level conversion circuit for deriving an output signal having a positive level from an input signal having a negative level comprising:
Dependencies are inferred from the claim text.
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No related US applications are recorded in the indexed filing history.
Interface arrangements: with at least one differential stage
Pulse technique
Term ended 9 Jun 2000 (estimated)
USPTO file history isn’t available for this patent, so only indexed dates are shown.
This invention relates to a level conversion circuit such as one used as the interface between the output of an ECL circuit and the input of a TTL circuit or an N-MOS circuit, for example.
Since the ECL (emitter coupled logic) circuit makes use of a negative power source voltage V.sub.EE, the signal level of the ECL circuit varies between ground potential (GND) and the negative power source voltage V.sub.EE. On the other hand, the TTL (transistor-transistor logic) circuit or the N-MOS (N channel insulated gate field effect transistor) circuit makes use of a positive power source voltage V.sub.CC and hence, the signal level of the TTL circuit or of the N-MOS circuit varies between the positive power source voltage V.sub.CC and ground potential (GND).
As the interface between the output of the first circuit operating on the negative power source voltage V.sub.EE and the input of the second circuit operating on the positive power source voltage V.sub.CC, a signal level conversion circuit is necessary. In an IC.sub.1 encompassed by the two-dot chain line in FIG. 1, a circuit indicated by l.sub.2 is a heretofore known semiconductor integrated circuit, forming a signal level conversion circuit. A first power terminal of the ECL circuit l.sub.1 is connected to the ground potential (GND) and a negative power source voltage V.sub.EE (e.g., -5.2 V) is impressed upon a second power terminal P.sub.2. Accordingly, the signal level of an output signal y obtained from an output terminal P.sub.7 of the ECL circuit l.sub.1 varies between the ground potential (GND) and the negative power source voltage V.sub.EE. A positive power source voltage V.sub.CC (e.g., +5.0 V) is impressed upon a first power terminal P.sub.10 of the TTL circuit l.sub.3 and its second power terminal P.sub.16 is connected to the ground potential (GND). Hence, the signal level of the TTL circuit l.sub.3 varies between the positive power source voltage V.sub.CC and ground potential (GND). The heretofore known level conversion circuit l.sub.2 is disposed between the output terminal P.sub.7 of the ECL circuit l.sub.1 and the input terminal P.sub.15 of the TTL circuit l.sub.3.
FIG. 1 is a circuit diagram of the heretofore known circuit;
FIG. 2 is a circuit diagram of an embodiment of the present invention;
FIG. 3 is a block diagram of a MOS memory;
Hereinafter, the preferred embodiments of the present invention will be explained in detail.
FIG. 2 is a circuit diagram showing the signal level conversion circuit l.sub.2 of an embodiment of the present invention together with the ECL circuit l.sub.1 and the N-MOS memory l.sub.3.
Though not limited in particular, the abovementioned ECL circuit l.sub.1 comprises a bias circuit consisting of resistors R.sub.1 -R.sub.3, diodes D.sub.1 and D.sub.2 and a transistor Q.sub.1 and a logic circuit consisting of resistors R.sub.4 -R.sub.6 and transistors Q.sub.2 -Q.sub.7 as shown in the drawing.