Semiconductor device with high density low temperature deposited Si.sub.w N.sub.x H.sub.y O.sub.z passivating layer
AssigneeHitachi, Ltd.
InventorsKiichiro Mukai, Seiki Harada, Shin-ichi Muramatsu, Atsushi Hiraiwa, Shigeru Takahashi, Katsuhisa Usami, Seiichi Iwata, Satoru Ito, Takeo Yoshimi
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Abstract
A semiconductor device has a passivation layer disposed on a semiconductor body having at least one circuit element therein. This layer is made of a silicon nitride material containing 0.8-5.9 weight-% of H, together with 61-70 weight-% of Si, 25-37 weight-% of N and up to 0.6 weight-% of O and has a density of 2.9-3.05 gr/cm.sup.3.
Claims5
A semiconductor device comprising a passivation layer which is disposed on a semiconductor body having at least one circuit element therein and which is made of a silicon nitride material consisting essentially of 61-70 weight-% of Si, 25-37 weight-% of N, 0.8-5.9 weight-% of H and up to 0.6 weight-% of O and having a density of 2.9-3.05 gr/cm.sup.3, wherein said semiconductor body includes a silicon dioxide film which is disposed on a semiconductor wafer and which has an opening at a predetermined position, an inorganic insulating film of phosphosilicate glass or the silicon nitride material which is disposed on said silicon dioxide film and which has openings at predetermined positions, and an interconnecting conductor layer of predetermined pattern which extends on said inorganic insulating film and which connects with predetermined regions in said wafer via said openings of said inorganic insulating film and said opening of said silicon dioxide film, wherein said passivation layer has a metal layer of predetermined pattern which extends on said passivation layer and which connects with said interconnecting conductor layer via an opening existent at a predetermined position of said passivation layer, and wherein said metal layer is extended over an active region of said semiconductor wafer and is used as a bonding pad.
A semiconductor device comprising a passivation layer which is disposed on a semiconductor body having at least one circuit element therein and which is made of a silicon nitride material consisting essentially of 61-70 weight-% of Si, 25-37 weight-% of N, 0.8-5.9 weight-% of H and up to 0.6 weight-% of O and having a density of 2.9-3.05 gr/cm.sup.3, wherein said semiconductor body includes a silicon dioxide film which is disposed on a semiconductor wafer and which has an opening at a predetermined position, an inorganic insulating film of phosphosilicate glass or the silicon nitride material which is disposed on said silicon dioxide film and which has openings at predetermined positions, and an interconnecting conductor layer of predetermined pattern which extends on said inorganic insulating film and which connects with predetermined regions in said wafer via said openings of said inorganic insulating film and said opening of said silicon dioxide film, said passivation layer having on its surface a film of one resin selected from the group consisting of a PIQ resin, a polyimide resin and a polyamide resin, the resin film having a metal layer of predetermined pattern which extends on said resin film and which connects with said interconnecting conductor layer via an opening existent at a predetermined position of said passivation layer including said resin film, and said metal layer extending over an active region of said semiconductor wafer and providing a bonding pad.
Dependencies are inferred from the claim text.