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US 4,365,005 AGranted
Method of forming a laminated ribbon structure and a ribbon structure formed thereby
AssigneeMassachusetts Institute of Technology
InventorsAugust F. Witt, Ramaswamy V. Raman
Life of this patent
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Abstract
A method of forming, by melt-spinning techniques, a laminated ribbon structure consisting, for example, of a semiconductor disposed on a metal ribbon substrate. The substrate may be 10-50 .mu.m thick and the semiconductor may be 10-50 .mu.m thick, for example; typically the ribbon width is about one millimeter to several centimeters.
Claims11
A multi-layered ribbon that comprises, a supporting substrate having a thickness in the range from about 10 to 50 micrometers;
- and at least one electrically active layer formed upon the substrate and in electrical contact therewith, the thickness of the active layer being in the range of about 10 to 50 micrometers.
Dependencies are inferred from the claim text.