Fire resistant compositions and composites

A fire resistant composite having low thermal conductivity, consisting essentially of a structural substrate selected from the group consisting of graphite fabric, glass fabric and a low melting point metal, containing a composition comprising a cured mixture of a resin selected from the group consisting of polyimide, epoxy, polybenzimidazole, polyester, polyquinoxyline, phenolic and silicone resins;

• and an additive consisting of a phosphorylated amide, said additive being soluble in said resin to provide a homogeneous composition and employed in an amount sufficient to enable formation of a stable resin char, and which composition is permanently bonded to said structural substrate thereby improving char characteristics and providing low thermal conductivity thereto and permitting such substrate to maintain structural integrity thereof when said composition is heated by a flame to a temperature of about 2000 degrees F., said additive being a phosphorylated amide having the general formula ##STR12## where Y is O or S, R is selected from the group consisting of H, alkyl containing from about 1 to about 6 carbon atoms, cycloalkyl containing from about 5 to about 7 carbon atoms, aryl containing from about 6 to about 14 carbon atoms, the corresponding halogenated alkyl and aryl groups, nitroaryl containing about 6 14 carbon atoms, heterocyclic containing 5 to 6 members in the heterocyclic nucleus, and O, N or S as hetero atoms, and where R.sub.1 and R.sub.2 can be the same or different, and are selected from the group consisting of H, alkyl, aryl, and cycloalkyl, all as defined above for R, amino, alkylamino containing from about 1 to about 8 carbon atoms in the alkyl group, arylamino containing from about 6 to about 14 carbon atoms, aliphatic acyl containing from about 1 to about 7 carbon atoms, and aroyl containing from about 7 to about 11 carbon atoms.

A fire resistant composition having low thermal conductivity, consisting essentially of a mixture of a resin selected from the group consisting of epoxies and condensation polymers;

• and a phosphorylated amide as an additive;
• and which resin is selected so that it has the following properties and characteristics (1) the additive is soluble in the resin and (2) when contacted with the additive such resin will form a stable resin char when heated by a flame to an elevated temperature of about 2000 degrees F. and (3) the fire resistance of the resin is increased and its thermal conductivity is decreased when contacted by the additive and so heated;
• said composition being capable of being cured and permanently bonded to a structural substrate to improve char characteristics and provide low thermal conductivity thereto and to permit such substrate to maintain structural integrity thereof, said additive being solubilized in said resin to form a homogeneous composition and employed in an amount sufficient to form said stable resin char when said composition is heated by a flame to an elevated temperature of about 2000 degrees F.;
• said phosphorylated amide having the following general formula ##STR13## where Y is O or S, R is selected from the group consisting of H, alkyl containing from about 1 to about 6 carbon atoms, cycloalkyl containing from about 5 to about 7 carbon atoms, aryl containing from about 6 to about 14 carbon atoms, the corresponding halogenated alkyl and aryl groups, nitroaryl containing about 6 14 carbon atoms, heterocyclic containing 5 to 6 members in the heterocyclic nucleus, and O, N or S as hetero atoms, and where R.sub.1 and R.sub.2 can be the same or different, and are selected from the group consisting of H, alkyl, aryl, and cycloalkyl, all as defined above for R, amino, alkylamino containing from about 1 to about 8 carbon atoms in the alkyl group, arylamino containing from about 6 to about 14 carbon atoms, aliphatic acyl containing from about 1 to about 7 carbon atoms, and aroyl containing from about 7 to about 11 carbon atoms.

A fire resistant composite having low thermal conductivity, consisting essentially of a structural substrate selected from the group consisting of graphite fabric, glass fabric and a low melting point metal, containing a composition comprising a cured mixture of a resin selected from the group consisting of epoxies and condensation polymers and an additive consisting of a phosphorylated amide, and which resin is selected so that it has the following properties and characteristics (1) the additive is soluble in the resin and (2) when contacted with the additive such resin will form a stable resin char when heated to an elevated temperature about 2000 degrees F. and (3) the fire resistance of the resin is increased and its thermal conductivity is decreased when contacted by the additive and so heated;

• said composition being permanently bonded to a structural substrate improving char characteristics and providing low thermal conductivity thereto and permitting such substrate to maintain structural integrity thereof, said additive being solubilized in said resin to form a homogeneous composition and employed in an amount sufficient to form said stable resin char when said composition is heated by a flame to an elevated temperature of about 2000 degrees F.;
• said additive is a phosphorylated amide having the general formula ##STR14## where Y is O or S, R is selected from the group consisting of H, alkyl containing from about 1 to about 6 carbon atoms, cycloalkyl containing from about 5 to about 7 carbon atoms, aryl containing from about 6 to about 14 carbon atoms, the corresponding halogenated alkyl and aryl groups, nitroaryl containing about 6 14 carbon atoms, heterocyclic containing 5 to 6 members in the heterocyclic nucleus, and O, N or S as hetero atoms, and where R.sub.1, and R.sub.2 can be the same or different, and are selected from the group consisting of H, alkyl, aryl, and cycloalkyl, all as defined above for R, amino, alkylamino containing from about 1 to about 8 carbon atoms in the alkyl group, arylamino containing from about 6 to about 14 carbon atoms, aliphatic acyl containing from about 1 to about 7 carbon atoms, and aroyl containing from about 7 to about 11 carbon atoms.

A fire resistant composition having low thermal conductivity, consisting essentially of a cured mixture of a resin selected from the group consisting of polyimide, epoxy, polybenzimidazole, polyester, polyquinoxyline, polyacrylate, phenolic and silicone resins;

• and a phosphorylated amide as an additive, said additive being soluble in said resin and employed in an amount sufficient to form a stable resin char upon being heated by a flame to an elevated temperature of about 2000 degrees F., said phosphorylated amide having the general formula ##STR15## where Y is O or S, R is selected from the group consisting of H, alkyl containing from about 1 to about 6 carbon atoms, cycloalkyl containing from about 5 to about 7 carbon atoms, aryl containing from about 6 to about 14 carbon atoms, the corresponding halogenated alkyl and aryl groups, nitroaryl containing about 6 14 carbon atoms, heterocyclic containing 5 to 6 members in the heterocyclic nucleus, and O, N or S as hetero atoms, and where R.sub.1 and R.sub.2 can be the same or different, and are selected from the group consisting of H, alkyl, aryl, and cycloalkyl, all as defined above for R, amino, alkylamino containing from about 1 to about 8 carbon atoms in the alkyl group, arylamino containing from about 6 to about 14 carbon atoms, aliphatic acyl containing from about 1 to about 7 carbon atoms, and aroyl containing from about 7 to about 11 carbon atoms, and where at least R.sub.1 or R.sub.2 is aroyl.

A method of rendering a structural substrate composite with properties of low thermal conductivity and increased fire resistance and ability to maintain structural integrity when heated by a flame to a temperature of about 2000 degrees F., said method comprising bonding to said substrate a fire resistant composition and curing said composition and which composition consists essentially of a mixture of a resin selected from the group consisting of polyimide, epoxy, polybenzimidazole, polyester, polyquinoxyline, polyacrylate, phenolic and silicone resins, and a phosphorylated amide as an additive;

• said additive being soluble in said resin and said resin being present in an amount sufficient and said composition being employed in an amount sufficient to form a cured stable resin char and to permit the substrate to maintain structural integrity when said composition is heated by a flame to an elevated temperature of about 2000 degrees F., said phosphorylated amide having the general formula ##STR17## where Y is O or S, R is selected from the group consisting of H, alkyl containing from about 1 to about 6 carbon atoms, cycloalkyl containing from about 5 to about 7 carbon atoms, aryl containing from about 6 to about 14 carbon atoms, the corresponding halogenated alkyl and aryl groups, nitroaryl containing about 6 14 carbon atoms, heterocyclic containing 5 to 6 members in the heterocyclic nucleus, and O, N or S as hetero atoms, and where R and R.sub.2 can be the same or different, and are selected from the group consisting of H, alkyl, aryl, and cycloalkyl, all as defined above for R, amino, alkylamino containing from about 1 to about 8 carbon atoms in the alkyl group, arylamino containing from about 6 to about 14 carbon atoms, aliphatic acyl containing from about 1 to about 7 carbon atoms, and aroyl containing from about 7 to about 11 carbon atoms.

A fire resistant composite having low thermal conductivity, consisting essentially of a substrate selected from the group consisting of graphite fabric, glass fabric and a low melting point metal containing composition comprising a cured mixture of a resin selected from the group consisting of polyimide, epoxy, polybenzimidazole, polyester, polyquinoxyline, polyacrylate, phenolic and silicone resins, and a phosphorylated amide as an additive;

• said additive being soluble in said resin and employed in an amount sufficient to form a stable resin char upon being heated by a flame to an elevated temperature of about 2000 degrees F., said phosphorylated amide having the general formula ##STR19## where Y is O or S, R is selected from the group consisting of H, alkyl containing from about 1 to about 6 carbon atoms, cycloalkyl containing from about 5 to 7 carbon atoms, aryl containing from about 6 to about 14 carbon atoms, the corresponding halogenated alkyl and aryl groups, nitroaryl containing about 6 14 carbon atoms, heterocyclic containing 5 to 6 members in the heterocyclic nucleus, and O, N or S as hetero atoms;
• R.sub.2 is selected from the group consisting of H, alkyl containing from about 1 to about 6 carbon atoms, and aryl containing from about 6 to about 14 carbon atoms;
• and R.sub.3 is selected from the group consisting of H, aryl containing from about 6 to about 14 carbon atoms, and cycloalkyl containing from about 1 to about 8 carbon atoms.