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US 4,363,689 AGranted
Adhesive bonding process
AssigneeHenkel Corporation
InventorRichard R. Roesler
Life of this patent
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Abstract
Products are prepared containing a radiation-sensitive reactive material and a saturated polyol. The product is used to bond films either through radiation or free radical initiation. The product is usable for bonding such films as polyester, polyvinylchloride, polyethylene, nylon or acrylonitrile-butadienestyrene copolymers.
Claims18
A process for bonding a film selected from the group consisting of nylon, polyester, polyvinyl chloride, polyethylene, and acrylonitrile-butadiene-styrene copolymers to a substrate comprising contacting the substrate with an liquid adhesive of the formula:
- (a) from about 40% to about 90% by weight of a saturated polyol;
- and,
- (b) from about 10% to about 60% by weight of a reactive material having a radiation sensitive pi bond and having a boiling point greater than that of benzene, and mixtures thereof;
- and,
- positioning the film and the substrate such that the adhesive is between the substrate and film and thereafter polymerizing the reactive material to effect bonding.
2 more elements
Dependencies are inferred from the claim text.