Manufacture of chipboard
AssigneesMethanol Chemic Nederland V.O.F., Stamicarbon B.V.
InventorsArie Tinkelenberg, Henricus W. L. M. Vaessen, Kwai W. Suen
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Abstract
The invention concerns the production of particle board with a very substantially lowered formaldehyde emission as well as suitable binding agents. According to the invention the binding agent used in the production of the board is a combination of a polyisocyanate with a aminoplast resin containing 0.25 to 0.625 moles of formaldehyde per mole equivalent of aminogroups. The particle boards thus obtained possess satisfactory mechanical properties and a strongly reduced formaldehyde emission.
Claims10
A method for manufacturing chipboard or shaped objects by hardening at elevated temperatures and pressures lignocellulose-containing chip material with a polyisocyanate and aminoplast resin bonding agents, wherein an aminoplast resin having between 0.25 to 0.625 mole of formaldehyde per mole equivalent of amino groups is used in a quantity between 3% and 14% by weight relative to said chip material in combination with a polyisocyanate, which polyisocyanate is used in a quantity between 0.5% and 3.0% by weight relative to said chip material.
Aminoplast adhesive solution based on formaldehyde, urea and 0% to 70% by weight of melamine, relative to the quantity of melamine plus urea, wherein said adhesive contains between 0.25 and 0.625 mole of formaldehyde per mole equivalent of amino group.
Dependencies are inferred from the claim text.