Heat-resistant resin composition
AssigneeKanegafuchi Kagaku Kogyo Kabushiki Kaisha
InventorsKazuya Yonezawa, Hirosaku Nagano
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Abstract
A composition comprising a varnish of heat-resistant resin having active hydrogen in the molecule and a bismaleimide compound or derivative thereof admixed with the varnish affords a heat-resistant resin product of improved properties. Especially when a bismaleimide compound or derivative thereof is added to a varnish of polyimide resin having active hydrogen in the molecule and the composition is applied to a metal film substrate to form a resin film, the film has improved peel strength and, in itself, also has improved strength and elongation.
Claims10
A heat-resistant resin composition characterized in that the composition comprises a varnish of polyamide acid which is the precursor of polyimide heat-resistant resin having active hydrogen in the molecule and a bismaleimide compound or a derivative thereof admixed with the varnish.
Dependencies are inferred from the claim text.