Sintered metal bonded diamond abrasive articles
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsEiji Isobe, Izumi Hayakawa, Akira Emura
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Abstract
This invention provides a metal bonded diamond abrasive article of nickel-copper basis. The sintered metal bond, which consists essentially of 2 to 30% by weight of copper, 1 to 40% by weight of tin, 0.2 to 3% by weight of phosphorous, and at least 50% by weight of the remainder nickel, well disperses and retains diamond grits and minimizes the clogging and the variation in rate of stock removal.
Claims2
A metal bonded diamond abrasive article composed of a diamond powder and of a sintered nickel base metal bond retaining the diamond powder, which is characterized in that the sintered metal bond consists essentially of 2 to 30% by weight of copper, 1 to 40% by weight of tin, 0.2 to 3% by weight of phosphorous, and the balance of nickel, the total amount of copper, tin, and phosphorous being less than 50% by weight.
Dependencies are inferred from the claim text.