Polishing apparatus

An improvement in rotatable barrel polishing apparatus containing a polishing bath for circulating about workpieces to polish them as the barrel rotates about an axis, comprising in combination, workpiece support means disposed axially within the barrel holding separated side plates positioned at opposite ends of the barrel in the polishing bath to rotate inside the barrel in response to rotation of the barrel, fixtures in said side plates adapted to removably hold a plurality of longitudinally disposed workpiece retaining members in place between said side plates, rod shaped workpiece retaining members supporting workpieces thereon held in place in said fixtures for rotation within said barrel with said workpiece support means wherein said side plates include notches formed therein for receiving said rod shaped members, and the fixtures comprise an L-shaped shaft equipped with an eccentric ring, a groove in said rod like members near one end, supporting plates formed with through holes at the both sides of one of the notches mounted on at least one side plate for disposing the L-shaped shaft perpendicular to the axis, wherein the L-shaped shaft is inserted into said through holes and engages said groove to retain the shaft in one of said notches with the eccentric ring disposed for forced contact with the side plate thereby to removably retain the rod shaped member for removal by rotation of the eccentric ring by means of the L-shaped shaft.