Device for cooling freshly-soldered circuit boards

In a device for cooling printed circuit boards after mechanical soldering of heat-sensitive electrical components into such boards with the aid of a cooling air stream which is circulated in a substantially closed circuit with the aid of a fan means and a means for transporting such board past the air stream, wherein the improvement comprises:

• a somewhat C-shaped housing defining said closed circuit and positioned approximately perpendicular relative to a transport direction of said boards and embracing said means for transporting such boards at a distance with a pair of horizontally extending legs, each of said legs having air-outlet openings on surfaces thereof facing said boards, said air-outlet openings beings disposed at least at outer ends of said legs and being directed against opposite sides of said boards at an obtuse angle,
• said housing having a central opening therein allowing cooling air to be sucked-in via said opening and expelled through said legs to said air-outlet openings to establish an air current about said circuit boards, and
• said means for transporting such boards past the air stream comprising a transport means supporting freshly-soldered circuit boards only at their respective side edges in such a manner that opposite major surfaces of such boards are uncovered.