Assemblies of electrical components with printed circuit boards, and printed circuit board structures therefor

An assembly comprising:

• a printed circuit substrate composed of a molded thermoplastic material and having a component-mounting surface;
• an electrical component mounted on the substrate and having a body portion and axially extending leads, the substrate further having a pocket formed in the mounting surface for receiving and locating the body portion of the component with respect to the substrate so that the component leads extend along the mounting surface and so that at least part of said component projects outward of the adjacent outermost surface areas of said mounting surface;
• a plurality of preformed molded thermoplastic studs integral with said substrate and molded concurrently therewith as extensions thereof, said studs projecting outwardly of adjacent outermost surface areas of said mounting surface at spaced positions adjacent to selected portions of the component received in the pocket so as to be supportively backed by part of said substrate providing the bottom of said pocket, the studs at their outer ends having locking portions formed about said selected adjacent portions of the component by deformation of said ends after mounting of said component on said substrate so as to render said component simultaneously engaged on its opposite sides by, respectively, said stud locking portions and a firm seat provided for said component on the substrate side thereof at the bottom of said pocket, and so as by such simultaneous engagement to provide a fastening without play of such component to said substrate;
• a printed circuit conductor pattern deposited on the mounting surface and including lead-contact areas that are overlapped by portions of the leads of the component;
• and
• means for attaching the leads to the contact areas of the conductor pattern.

A printed circuit board structure having component parts capable of being assembled with an electrical component having leads projecting therefrom, which comprises:

• a molded thermoplastic substrate having printed circuit lead-contact areas deposited on a mounting surface of the substrate, on which mounting surface the component is adapted to be placed in a desired position at which at least part of said component projects outward of the adjacent outermost surface areas of said mounting surface, and in which portions of the component leads are aligned with the lead-contact areas;
• and
• a plurality of preformed molded thermoplastic pins integral with said substrate and molded concurrently therewith as extensions thereof, said pins projecting outwardly of the adjacent outermost surface areas of the mounting surface of the substrate to have the outer ends of the pins at positions adjacent to portions of the component which are adapted to be supportively backed by part of said substrate when the component is placed on the substrate, the pins having end portions adapted to be heated and formed about the adjacent portions of the component so as to form plastic locking portions, adapted to render said component engaged simultaneously on its opposite sides by, respectively, said locking portions and a firm seat provided for said component on the substrate side thereof, and so as, by such simultaneous engagement to provide a fastening without play of said component to said substrate.