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US 4,361,720 AGranted
Low thermal resistance insulating support and base or box for power component incorporating such a support
AssigneeThomson-CSF
InventorsJean-Claude Resneau, Jean Doyen, Robert Ribier
Life of this patent
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Abstract
A low thermal resistance insulating support permitting thermal stresses in the base of a high power component incorporating a beryllium oxide element without fractures or flaws occurring. The support includes a dissipating support made from copper, whose two large faces are slotted to at least partly house a beryllium oxide disk which receives a component and its connections to the outside. Such also completely houses a molybdenum disk with an expansion coefficient close to that of the beryllium oxide.
Claims8
A low thermal resistance insulating support comprising:
- a first element made from an electrically insulating and thermally conducting material and having a first face portion;
- a second element integrally connected to said first element at said first face portion and made from a metal with a higher expansion coefficient than that of said thermally conducting material of said first element;
- said second element having a first and second recess formed therein, and having a predetermined remaining thickness therebetween, said first recess being adjacent to the first face portion of said first element;
- and
- a metal member mounted in said second recess having an expansion coefficient close to that of said thermally conducting material, and having a thickness whose order of magnitude is substantially equivalent to said remaining thickness of said second element wherein said metal member is mounted within said second recess such that an outer surface portion thereof is flush with the surface of said second element.
2 more elements
Dependencies are inferred from the claim text.