Thermal backfill composition method

A thermally conductive composition comprising particulate material selected from sand and sand-like particles coupled with a binder comprising an organic adhesive and an inorganic fine particle size filler, said binder being present in a volume fraction, .phi..sub.B such that .phi..sub.f <.phi..sub.B .ltoreq..phi..sub.c wherein .phi..sub.f is the maximum volume fraction of binder for a film forming structure and .phi..sub.c is the volume fraction of binder to start to achieve a void filling structure, and said filler is present in the binder in a concentration range sufficient to give rise to a substantial percentage increase in the thermal conductivity of the composition as compared with that without filler and including at least one additive selected from a surfactant, a defoamer, coupling agent, and dispersant.

A thermally conductive composition comprising particulate material selected from sand and sand-like particles coupled with a binder comprising an organic adhesive and an inorganic fine particle size filler, said binder being present in a volume fraction, .phi..sub.B such that .phi..sub.f <.phi..sub.B .ltoreq..phi..sub.c wherein .phi..sub.f is the maximum volume fraction of binder for a film forming structure and .phi..sub.c is the volume fraction of binder to start to achieve a void filling structure, and said filler is present in the binder in a concentration range sufficient to give rise to a substantial percentage increase in the thermal conductivity of the composition as compared with that without filler and wherein the adhesive is a low molecular weight polymer selected from the group consisting of latex, epoxy, polyvinylester, polyester and polyether polymers.

A thermally conductive composition comprising particulate material selected from sand and sand-like particles coupled with a binder comprising an organic adhesive and an inorganic fine particle size filler, said binder being present in a volume fraction, .phi..sub.B such that .phi..sub.f <.phi..sub.B .ltoreq..phi..sub.c wherein .phi..sub.f is the maximum volume fraction of binder for a film forming structure and .phi..sub.c is the volume fraction of binder to start to achieve a void filling structure, and said filler is present in the binder in a concentration range sufficient to give rise to a substantial percentage increase in the thermal conductivity of the composition as compared with that without filler and wherein the average particle size of filler is less than about 50 microns.

A thermally conductive composition comprising particulate material selected from sand and sand-like particles coupled with a binder comprising an organic adhesive and an inorganic fine particle size filler, said binder being present in a volume fraction, .phi..sub.B such that .phi..sub.f <.phi..sub.B .ltoreq..phi..sub.c wherein .phi..sub.f is the maximum volume fraction of binder for a film forming structure and .phi..sub.f is the volume fraction of binder to start to achieve a void filling structure, and said filler is present in the binder in a concentration range sufficient to give rise to a substantial percentage increase in the thermal conductivity of the composition as compared with that without filler and wherein the filler is present in an amount ranging between .+-.0.6 to 1 times the amount which results in a peak effective thermal conductivity of the composition and the volume fraction of binder is between about 0.08 and 0.1.

A thermally conductive composition comprises sand coupled with a binder wherein the binder is present in a volume fraction .phi..sub.B of between .phi..sub.f and .phi..sub.c and wherein .phi..sub.f is the maximum volume fraction of binder for a film forming structure and .phi..sub.c is the volume fraction of binder to start to achieve a void filling structure, and wherein the binder comprises and adhesive selected from the group consisting of wax and a water emulsifiable latex polymer together with a filler selected from the group consisting of quartzitic particles, kaolin and graphite, the mass ratio of adhesive to dry sand plus filler being between 0.02 and 0.1 and the mass ratio of filler to dry sand being between 0.05 and 0.25, and the composition having a thermal conductivity of at least 1.0 W/m-K.

A method of making an essentially water free thermally conductive composition comprising sand or sand-like particles dispersed in a binder which comprises inorganic filler particles in an adhesive, comprising mixing in a mixing or blending apparatus a quantity of sand or sand-like particles together with an appropriate quantity of a water emulsifiable polymeric adhesive and filler to give a composite having a meniscus structure together with water, a dispersing agent and a defoamer and including the steps of applying the composition to a desired area and drying the composition to remove substantially all the water therein.