Method for reducing solder sticking on a printed wiring board
AssigneeWestern Electric Company, Inc.
InventorsJohn F. D'Amico, Michael A. DeAngelo, Jr., Manjini Saminathan
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Abstract
A method of inhibiting solder sticking between circuit elements of a partially uncured rubber-modified epoxy printed circuit board comprises exposing the board containing the circuit pattern thereon to UV radiation prior to the application of solder thereto.
Claims13
A method for inhibiting solder sticking on a printed circuit board comprising a metallic circuit pattern on a partially uncured rubber-modified epoxy base wherein the epoxy is from 92-98% cured comprising the step of exposing said circuit board containing said circuit pattern to ultraviolet radiation of less than 3200 A. to further cure said uncured rubber-modified epoxy base thereby making it less receptive to wetting by the solder.
A method of manufacturing a printed circuit board comprising the steps of:
- (a) forming a metallized circuit pattern on a 92-98% cured rubber-modified epoxy surface;
- (b) exposing said surface to ultraviolet radiation;
- to further cure said uncured rubber-modified epoxy base thereby making it less receptive to wetting by the solder and
- (c) applying solder over the surface and circuit pattern such that said solder essentially coats and adheres only to the metallized pattern.
Dependencies are inferred from the claim text.