Cutter for blocks of wafers

An apparatus for cutting blocks of wafers comprising:

• at least one first cutting member;
• first means for transporting blocks of wafers to said first cutting member, said first transport means including a first endless revolving member disposed above the plane of transport of said wafers;
• first means for applying pressure to said blocks of wafers in the direction of transport, said first pressure means comprising a plurality of first pressure components mounted on said endless revolving member and extending downwardly therefrom;
• wherein the distance between two consecutive first pressure components following each other in the direction of transport is greater than the width or length of the blocks of wafers to be cut;
• a second cutting member having a cutting plane arranged at an angle of 90.degree. to said first cutting member;
• a second means for transporting blocks of wafers, said second transport means arranged to transport said blocks of wafers from the first cutting member to the second cutting member;
• said second transport means comprising a second endless revolving member disposed above the plane of transport of said wafers and having a second means for applying pressure to said blocks of wafers, said second pressure applying means comprising a plurality of second pressure components extending downwardly from said second endless revolving member;
• and
• a rack member mounting said first transport means;
• wherein said rack member extends parallel to the plane of transport of the blocks of wafers and is movable vertically relative to the plane of transport for causing said first pressure components to move into and out of said plane of transport.