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US 4,359,556 AGranted
Thermoplastic polyamide hot melt adhesive composition
AssigneeGulf Oil Corporation
InventorsPallavoor R. Lakshmanan, Benedict J. Monachino
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Abstract
Hot melt adhesive compositions are provided which contain 40-98 weight % of a thermoplastic polyamide resin derived from a dimer acid and a low molecular weight aliphatic diamine, and 2-60 weight % of an alkenyl succinic anhydride.
Claims5
A hot melt adhesive composition consisting essentially of:
- (a) 40-98 weight percent of a thermoplastic polyamide resin derived from dimer acid and a low molecular weight aliphatic diamine, and
- (b) 2-60 weight percent of an alkenyl succinic anhydride;
- said alkenyl succinic anhydride having the structure:
- ##STR2## where R is an alkyl group containing about 15-49 carbon atoms;
- said polyamide resin having a molecular weight in the range of about 2,000 to 20,000 and a Ring and Ball softening point in the range of about 85.degree. C. to 200.degree. C.
2 more elements
Dependencies are inferred from the claim text.