Process for forming a high resolution recording medium
AssigneeDr. Johannes Heidenhain GmbH
InventorsHeinz Kraus, Erich Bayer
Life of this patent
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Abstract
A process for forming a high resolution recording medium including at least a high resolution, patterned interference filter formed from at least two reflecting layers separated by an interference layer including the step of removing patterned portions of a reflective layer not protected by a photosensitive layer by means of chemical etching or ion beam etching. When chemical etching is used, the etching process is accelerated to reduce under-etching by maintaining a rapid, thorough, and continuous boundary surface exchange of the etching solution at the boundary between the etching solution and the reflective layer being etched.
Claims2
A process for producing a high resolution recording medium comprising the following steps:
- (a) applying a first reflecting layer of an inorganic material to a first side of a substrate;
- (b) apply a first layer of photosensitive material to the first reflecting layer;
- then
- (c) exposing a patterned portion of the photosensitive material and thereupon developing the photosensitive material;
- then
- (d) removing those portions of the first reflecting layer not covered by photosensitive material by wet chemical etching, wherein etching agent is applied to the first reflecting layer as a spray;
- then
- (e) removing the remaining photosensitive material;
- then
- (f) applying an interference layer to the first side of the substrate, said interference layer having a substantially uniform thickness and comprising an inorganic material which is substantially absorption-free in the visible range of the spectrum;
- (g) applying at least a second reflecting layer of inorganic material to the interference layer;
- (h) applying a second layer of photosensitive material to the second reflecting layer;
- then
- (i) exposing a patterned portion of the photosensitive material and thereupon developing the photosensitive layer;
- then
- (j) removing those portions of the second reflecting layer not covered by photosensitive material by wet chemical etching, wherein etching agent is applied to the second reflecting layer as a spray;
- and then
- (k) removing the remaining photosensitive material.
Dependencies are inferred from the claim text.