Terraced substrate semiconductor laser
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTakashi Sugino, Masaru Wada, Hirokazu Shimizu, Kunio Itoh
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Abstract
In a semiconductor laser comprising a terrace-shaped semiconductor substrate, a first clad layer formed on the semiconductor substrate, an active layer formed on the first clad layer and having two discontinuity places at bending portions of the first clad layer, a second clad layer formed on the active layer, and a current injection electrode above a lasing region in the active layer, the improvement is that a stable fundamental transverse lasing mode and a circular laser beam are obtainable from the lasing region definitely separated by two discontinuity places in the active layer.
Claims5
In a semiconductor laser the improvement comprising:
- a terrace-shaped semiconductor substrate having an upper face, a lower face and a step part disposed between said upper face and said lower face,
- a first clad layer formed on said semiconductor substrate to have an upper flat part, a lower flat part and a central sloped surface part disposed between said upper flat part and said lower flat part, said upper flat part being on said upper face, said lower flat part being on said lower face, and said central sloped surface part being on said lower face and on said step part,
- an active layer formed on said first clad layer and having two discontinuity places on the parts which are on bending parts from said central sloped surface parts to said upper flat part and to said lower flat part, said active layer has a thickness on said central sloped surface part larger than those on said upper flat part and said lower flat part, said active layer including a lasing region on said central sloped surface part between said two discontinuity places,
- a second clad layer formed on said active layer, and
- a current injection electrode disposed above said lasing region.
In a semiconductor laser the improvement comprising:
- a terrace-shaped semiconductor substrate having an uppermost face, an intermediate face, a lowest face, a first step and a second step, said first step being disposed between said uppermost face and said intermediate face, and said second step being disposed between said intermediate face and said lowest face,
- a first clad layer formed on said semiconductor substrate to have an upper flat part, a lower flat part and a central sloped surface part disposed between said upper flat part and said lower flat part, said upper flat part being on said uppermost face, said lower flat part being on said lowest face, and said central sloped surface part being on said first step, said intermediate face, said second step and said lowest face,
- an active layer formed on said first clad layer and having discontinuity places above edges of said first step and said second step, said active layer including a lasing region on said central sloped surface part of said first clad layer between said two discontinuity places,
- a second clad layer formed on said active layer, and
- a current injection electrode disposed above said lasing region.
Dependencies are inferred from the claim text.