Compression type semiconductor device
AssigneeTokyo Shibaura Denki Kabushiki Kaisha
InventorsKatsuhiko Takigami, Makoto Azuma
Life of this patent
Estimating the term…
Abstract
A compression type semiconductor device includes a semiconductor element; at least one metal plate having substantially upright edge surfaces, a planar contacting surface engaging a first surface of the semiconductor element and a continuous curved surface interconnecting the edge surfaces and the contacting surface; and a means for pressing the contacting surface of the metal plate against the first surface of the semiconductor element. The continuous curved surface of the metal plate is so formed that at each point on the periphery of the contacting surface at least one plane normal to the contacting surface intersects the curved surface in an arcuate curve which tangentially joins the contacting surface.
Claims11
A compression type semiconductor device, comprising:
- a semiconductor element;
- at least one metal plate having substantially upright edge surfaces, a planar contacting surface engaging a first surface of the semiconductor element, and a continuous curved surface interconnecting said edge surfaces and said contacting surface, wherein at each point on the periphery of said contacting surface at least one plane normal to said contacting surface intersects said curved surface in an arcuate curve which tangentially joins said contacting surface;
- and
- compression means including a metal stamp for pressing said contacting surface of said metal plate against said first suface of said semiconductor element;
- wherein the metal plate has a thermal expansion coefficient intermediate those of the semiconductor element and the metal stamp.
Dependencies are inferred from the claim text.