Four component hot-melt adhesives
AssigneeEastman Kodak Company
InventorBrenda J. Boggs
Life of this patent
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Abstract
The hot-melt adhesives of the present invention comprise a blend of ethylene-vinyl acetate copolymer, hydrocarbon tackifier resin, aromatic low softening point tackifying resin and paraffin wax. These hot-melt adhesive compositions provide adhesives especially useful for bonding polyethylene film to a nonwoven support. The bonds provided by this adhesive have a novel combination of properties such as good static shear lap bond strength, low elongation and good elevated temperature properties.
Claims10
An adhesive composition capable of being used as a hot melt adhesive comprising a blend of
- (a) about 10 to 20 percent by weight of at least one aromatic hydrocarbon resin having a softening point of less than 50.degree. C.,
- (b) about 30 to 40 percent by weight of at least one ethylene-vinyl acetate copolymer,
- (c) about 35 to 55 percent by weight of at least one tackifier resin selected from the group consisting of hydrocarbon resin, polyterpene resin and rosin ester resin, and
- (d) about 2.5 to 10 percent by weight of a paraffin wax having a Ring and Ball Softening Point of about 120.degree. C. to 160.degree. C.
An adhesive composition capable of being used as hot melt adhesive comprising a blend of
- (a) about 8 to 15 weight percent of at least one aromatic hydrocarbon resin having a softening point of less than 50.degree. C.,
- (b) about 30 to 35 weight percent of at least one ethylene-vinyl acetate copolymer,
- (c) about 45 to 50 weight percent of at least one tackifier selected from the group consisting of hydrocarbon resin, polyterpene resin or rosin ester resin, and
- (d) about 5 percent by weight of paraffin wax having a Ring and Ball softening point of about 140.degree. C. to 150.degree. C.
Dependencies are inferred from the claim text.