Densification of porous refractory substrates
AssigneeThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration
InventorsGlenn M. Ecord, Calvin Schomburg
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Abstract
A hydrolyzed tetraethyl orthosilicate is applied to the surface of a porous refractory substrate following which the substrate is heated to a temperature and for a period of time sufficient to bond the silica released from the tetraethyl orthosilicate to the substrate thereby densifying and strengthening the surface.
Claims12
A method of densifying a porous refractory substrate comprising penetrating a surface of said substrate with a densifying agent comprised of a hydrolyzed tetraethyl orthosilicate, and heating said substrate at an elevated temperature and for a period of time sufficient to bond silica released from said densifying agent to said substrate.
Dependencies are inferred from the claim text.