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US 4,358,479 AGranted
Treatment of copper and use thereof
AssigneeInternational Business Machines Corporation
InventorsMichael J. Canestaro, Edmond O. Fey
Life of this patent
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Abstract
A method for modifying the surface characteristics of copper foil by contacting a surface thereof with an oxidizing composition; and use of the treated copper foil in the preparation of printed circuits.
Claims11
A method for preparing a printed circuit which comprises:
- (A) contacting a nodular surface of a copper foil with an oxidizing composition for a length of time sufficient to oxidize said nodular surface of said copper foil to further roughen said nodular surface;
- (B) laminating the copper foil and dielectric substrate material together with said nodular surface confronting the surface of said substrate;
- (C) removing the copper from said substrate etching;
- (D) catalyzing said substrate for electroless metal deposition subsequent to removing the copper in step (C);
- and
- (E) electrolessly plating the substrate with conductive metal.
3 more elements
Dependencies are inferred from the claim text.