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US 4,358,044 AGranted
Apparatus for soldering solder on ceramic substrate
AssigneeAsahi Glass Company, Limited
InventorHitoshi Igarashi
Life of this patent
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Abstract
An apparatus for soldering a solder on a difficultly solderable substrate comprises a vibration tip which is rotatably held and is mounted on an ultrasonic oscillation mechanism and is slidably held to the vertical direction to an object for soldering. A needle part is placed in a predetermined distance and a predetermined direction from the edge of said vibration tip and said needle part is projected in substantially the same level as that of said edge of said vibration tip.
Claims3
An apparatus for soldering a solder on a solderable substrate, comprising:
- an ultrasonic oscillation mechanism having a vibration tip rotatably held and slidably mounted thereon, said vibration tip slidably movable in a vertical direction relative to an object for soldering;
- a needle part placed at a predetermined distance and at a predetermined direction from said vibration tip, said needle part projected at about the level of an edge of said vibration tip;
- means for enabling backward shifting of said needle part on contacting of said needle part with said object;
- and
- means for activating said ultrasonic oscillation mechanism such that ultrasonic vibration is applied to said vibration tip when said needle part is backwardly shifted a predetermined distance.
2 more elements
Dependencies are inferred from the claim text.