Method of making circuit path conductors in plural planes

A method for forming circuit path conductors along plural planes, comprising the steps of:

• adhering a conductive layer onto a substrate of dielectric having the characteristic, in response to the application of pressure, of forming a permanent indentation with an abruptly sloped periphery,
• indenting the assembly of said conductive layer and said substrate with an impression die the face of which includes projecting portions and recessed portions defining a pattern of circuit paths,
• dividing first portions of said conductive layer from second portions thereof alone lines of shear formed by penetration of said projecting portions of said die pattern through said conductive layer,
• forming recess portions with abruptly sloped peripheries along said lines of shear formed by penetration of said die pattern into the surface and thickness of said substrate,
• insetting said first portions of said conductive layer in said recess portions, separating and electrically isolating said first portions from said second portions of said conductive layer along the abruptly sloped peripheries of said recess portions, and
• selectively forming transition portions of said conductive layer between certain ones of said first portions and certain ones of said second portions thereby interconnecting these certain ones of said first and second portions together.