Flexible printed circuit base board and method for producing the same

Abstract

There are disclosed a flexible printed circuit base board produced as an elemental material suitable for a flexible printed circuit board by coating a heat-resistant resin composition composed of a heat-resistant resin having a heterocyclic ring and an epoxy resin dissolved in an organic solvent on a metal foil and drying it to form a film directly on said foil, and a method for producing the same. Said flexible printed circuit base board is more excellent in heat resistance, flame retardancy, adhesiveness, electric insulation, and heat deterioration characteristics than the conventional base board obtained by integrating a heat-resistant film and a metal foil through an adhesive. These properties are of great importance in practical applications of the printed circuit base board. As compared with the conventional products, the production is easy, and hence, the present base board can be produced at a low cost. This base board is not only usable for various types of flexible printed circuit boards but also the film per se obtained from the base board can be used in a field in which a film is used.

Dependencies are inferred from the claim text.