Bis-maleimide/divinyl aryl crosslinking agent resin system

Abstract

A novel bis-imide matrix resin system comprising 50 to 95 percent by weight of ethylenically unsaturated bis-imides, preferably a low melting mixture of a major portion of maleimides of aromatic amines with a minor portion of maleimide of an aliphatic amine and 5 percent to 35 percent by weight of a diunsaturated low-temperature cross-linking agent such as divinyl benzene which gels the bis-imide at low temperatures. This reduces stress between the matrix resin and the surface of the reinforcing fiber, thus reducing the tendency to form microcracks. Microcracking is further reduced and transverse strength is increased by the addition of 0 to 15% of compatible elastomers to the resin and cross-linking agent. Room temperature tackiness, heat resistance and cross-link density are improved by the presence of 0 to 10% of a trifunctional curing agent.

Dependencies are inferred from the claim text.