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US 4,351,916 AGranted
Polyoxymethylene molding blends
AssigneeE. I. Du Pont de Nemours and Company
InventorMelvin I. Kohan
Life of this patent
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Abstract
A polyoxymethylene molding composition comprising an admixture which contains a small amount of poly(ethylene glycol) and a small amount of a dispersion of polyamide in a carrier resin.
Claims8
A polyoxymethylene blend consisting essentially of
- (a) polyoxymethylene,
- (b) 0.1-10 percent, preferably 0.5-5 percent, by weight of blend, poly(ethylene glycol), and
- (c) 0.15-3 percent, preferably 0.4-2.0 percent, by weight of blend, of a dispersion of polyamide in a carrier resin, the polyamide comprising about from 10 to 50 wt % of the dispersion and being present in the carrier resin as particles no greater than about 5 microns;
- the carrier resin being inert to the oxymethylene polymer and having a melting point at or below the processing temperature of the oxymethylene polymer.
1 more element
Dependencies are inferred from the claim text.