Liquid cooled connector for integrated circuit packages

A connector for removably mounting and electrically connecting an integrated circuit package on a backpanel and dissipating the heat generated by operation of the integrated circuit package, the backpanel having holes formed therethrough, said connector comprising:

• (a) a thrust/heat dissipating member of substantially planar configuration for placement in overlaying engagement with the integrated circuit package and movable toward the backpanel for exerting a force on the integrated circuit package to pressurize the leads thereof into conductive contact with aligned terminal pads of the backpanel when the integrated circuit package is aligningly positioned thereon, said thrust/heat dissipating member having means for absorbing and dissipating the heat generated by operation of the integrated circuit package;
• (b) a thrust inducing mounting plate for positioning in contiguous engagement with the opposite surface of the backpanel;
• and
• (c) complemental elements of a demountable biased connection on said thrust/heat dissipating member and on said thrust inducing mounting plate for interconnection thereof through the holes of the backpanel to move said thrust/heat dissipating member toward the backpanel for pressurized mounting and electrical connection of the integrated circuit package on the backpanel.