Method of securing an adhesive attachment assembly to a substrate

The method of applying an attachment to a substrate, comprising the steps of:

• mounting the attachment upon a support member movable between two positions into and out of bearing engagement with the substrate;
• applying a curable adhesive to at least one of the mating surfaces between the attachment and the substrate;
• securing a resilient member to the support member;
• temporarily adhering the resilient member to the support member with a pressure-sensitive adhesive and with the support member in one position to support the attachment out of substantial bearing engagement with the substrate;
• moving the support member to its other position to move the attachment into bearing engagement with the substrate, said moving step including moving the support member a sufficient distance with respect to the resilient member to place the resilient member in tension whereby the resilient member urges the support member and the attachment toward the substrate;
• and
• removing the support member from the substrate and the attachment after substantial curing of the curable adhesive while leaving the attachment in engagement with the substrate.

The method of applying an attachment to a substrate, comprising the steps of:

• mounting the attachment upon the concave surface of a spring plate movable over center between a concave and convex position;
• applying a curable adhesive to at least one of the mating surfaces between the attachment and the substrate;
• securing a resilient member to the concave surface of the spring plate adjacent to the attachment;
• temporarily adhering the resilient member to the substrate;
• moving the spring plate over center to a convex position to place the resilient member in tension for urging the spring plate and the attachment toward the substrate into bearing engagement with the substrate;
• and
• thereafter removing the resilient member and the spring plate from the substrate to leave the attachment in engagement with the substrate.

The method of applying an attachment to a substrate, comprising the steps of:

• mounting the attachment upon a first support member;
• mounting the first support member upon a second support member for movement between two positions into and out of bearing engagement with the substrate;
• applying a curable adhesive to at least one of the mating surfaces between the attachment and the substrate;
• securing the second support member temporarily with respect to the substrate with the first support member in one position supporting the attachment out of substantial engagement with the substrate;
• moving the first support member to the other position to bring the attachment into bearing engagement with the substrate;
• applying to the attachment while in bearing engagement with the substrate a force reacting between the substrate and the side of the attachment opposite the substrate to urge the attachment toward the substrate;
• and
• removing the first and second support members from the attachment and the substrate after curing of the adhesive.