Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation

Abstract

A composition, suitable for encapsulation-type molding, containing from about 30 to 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent glass fibers, about 30 to about 60 weight percent of a component that can be glass beads or fused silica and about 0.5 to about 3 weight percent of organic silane. Preferably the composition also contains up to about 2 weight percent of a processing aid. A method for preparing a composition suitable for molding in which there is compounded a masterbatch of glass fiber and poly (arylenesulfide), the masterbatch is reduced to particles, and the masterbatch particles are blended with a sufficient amount of organic silane, additional poly (arylene sulfide) and a component chosen from glass beads and fused silica to provide a composition of about 30 to about 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent glass fibers, about 30 to about 60 weight percent glass beads, or fused silica and 0.5 to about 3 weight percent organic silane. An article of manufacture comprising a semiconductor chip encapsulated in a molded composition as described above.

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