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AssigneeNational Semiconductor Corporation
InventorCarmen D. Burns
Estimating the term…
A continuous tape is employed in the automatic assembly of semiconductor devices. The tape contains a sequential series of patterns, each one comprising a plurality of metal fingers. Each pattern includes fingers having an inward extension that terminates in a configuration that mates with the contact pattern of the semiconductor device. Desirably these fingers are thermocompression gang bonded to the semiconductor contact pads. This attaches the semiconductor device to the tape for further processing. In one assembly method the fingers have an outward extending portion that is designed for bonding to a secondary structure such as a lead frame destined to become part of the final housing. The fingers in the pattern are joined together by means of a ring located at or near the point at which they are bonded to the lead frame. After the lead frame bonds are achieved, preferably by thermocompression gang bonding, the ring is severed at locations between the fingers. If desired, the ring structure can be weakened at those points where it is to be severed.
A tape for the automatic assembly of semiconductor devices having a bonding pad array that is to be interconnected with elements of a secondary lead array, said tape including a plurality of sequential metal finger patterns comprising:
A tape process for assembling semiconductor devices wherein said tape includes a series of sequential metal finger patterns, each pattern including a plurality of fingers extending inwardly to form an array that mates with the contact pattern of a semiconductor device, said fingers also extending outwardly to form an array that mates with a secondary lead pattern that will serve to connect said semiconductor device to external circuitry, said process including the steps of:
Dependencies are inferred from the claim text.