Adjustable slide shoe for die carrier plate of injection molding machine

In an injection molding machine in which a machine base has mounted on it a die closing unit with a substantially horizontally oriented movement axis and, as part thereof, carries a stationary die carrier member to which is attached a stationary portion of an injection molding die, a movable die carrier member carrying a movable portion of said die, and a set of spaced tie rods which extend parallel to said movement axis, reaching axially through the movable die carrier member so as to position and guide the latter, the combination therewith of an adjustable supporting arrangement for the movable die carrier member comprising in combination:

• two fixed guide rails which are arranged on the machine base in parallel alignment with the tie rods of the die closing unit, below and on opposite sides of the movement axis of the latter, the guide rails having substantially horizontal guide tracks on their upper sides and substantially vertical guide tracks on their inner sides;
• two slide shoes which are attached to the movable die carrier member in such a way that they engage the guide rails, each slide shoe having vertical and horizontal guide faces in contact with the corresponding guide tracks of the rails;
• means for adjustably clamping the slide shoes to the movable die carrier member;
• and
• means for threadingly lowering each slide shoe in relation to the movable die carrier member, so as to make it possible to transfer from the tie rods to the horizontal guide tracks of the guide rails at least a substantial portion of the weight of the movable die carrier member and attached die portion.