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US 4,309,512 AGranted
Heat-resistant thermosetting resin composition
AssigneeTokyo Shibaura Denki Kabushiki Kaisha
InventorsYukihiro Mikogami, Takeo Ito, Moriyasu Wada
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AssigneeTokyo Shibaura Denki Kabushiki Kaisha
InventorsYukihiro Mikogami, Takeo Ito, Moriyasu Wada
Estimating the term…
A thermosetting resin composition containing as essential resin components (a) a maleimide compound modified with furfuryl alcohol, (b) an epoxy resin and (c) a polyvinyl formal, and a latent curing agent or a curing accelerator which is at least one compound selected from the group consisting of dicyandiamide, boron trifluoride-amine complexes, metal chelate compounds, and silicone compounds and organo-silane compounds having at least one hydroxyl group bonded directly to silicon atom, is found to be capable of B-staging with good storage stability and provides a heat-resistant resin composition having excellent electric characteristics at high temperatures after curing. The composition can suitably be coated on a glass cloth or a mica tape to give a pre-preg tape which can maintain its flexibility for a long time.
A heat-resistant resin composition, comprising a resin system essentially consisting of (a) a maleimide compound modified with furfuryl alcohol, (b) an epoxy resin and (c) a polyvinyl formal and, incorporated therein as a latent curing agent or a curing accelerator, at least one compound selected from the group consisting of dicyandiamide, boron trifluoride-amine complexes, metal chelate compounds, and silicone compounds and organo-silane compounds having at least one hydroxyl group bonded directly to silicon atom.
Dependencies are inferred from the claim text.