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US 4,309,267 AGranted
Reactive sputter etching apparatus
AssigneeBell Telephone Laboratories, Incorporated
InventorsGary D. Boyd, Larry A. Coldren, Frederick G. Storz
Life of this patent
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Abstract
An rf sputter etch or reactive sputter etch apparatus which can be used for etching substrates at oblique angles utilizes a cathode formed from a metal grid and an equipotential enclosure. The substrate is supported in the enclosure either parallel to or at an oblique angle to the surface of the grid.
Claims5
Apparatus for etching a substrate (2) which comprises:
- anode means (6) disposed parallel to cathode means (5) in a chamber (110);
- means (106) for introducing a gaseous etchant between said anode and said cathode means in said chamber;
- means (102) for applying an rf voltage between said anode and said cathode means;
- characterized in that:
- said cathode means comprises grid means (1) and an equipotential enclosure (8, 9 and 10), and means for supporting said substrate in said enclosure below said grid at an oblique angle to said grid, whereby said substrate may be etched.
2 more elements
Dependencies are inferred from the claim text.