A thick film capacitor comprising a substrate plate, a lower electrode formed on the substrate plate, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, characterized in that the dielectric layer is prepared from a low temperature-sinterable dielectric composition consisting of lead ferrotungstate, lead titanate and manganese dioxide, represented by the general formula
- A.Pb(Fe.sub.2/3 W.sub.1/3).sub.1-x Ti.sub.x O.sub.3 +B.MnO.sub.2
- wherein 0.005.ltoreq..times..ltoreq.0.35, A=0.95-0.9995 and B=0.0005-0.05.