Masking agent for the deposition of a material and method for such a deposition using this masking agent
AssigneeEbauches S.A.
InventorsClaude Ganguillet, Jacques Cognard, Yves Ruedin
Life of this patent
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AssigneeEbauches S.A.
InventorsClaude Ganguillet, Jacques Cognard, Yves Ruedin
Estimating the term…
To prepare a masking agent resistant to temperature, one adds silica powder to a photoresist. The mixture thus obtained is used to produce selective deposition of a layer of material on a substrate. The mixture of photoresist and silica powder serves as a photo-sensitive protective material which is then eliminated partially by selective exposure to light and use of a photographic developer. The temperatures involved in the deposition of the layer of desired material, for instance tin oxide, are about 500.degree. C. (deposition in the vapor phase), and the photo-sensitive material would be liable to destruction if it did not contain silica powder. It is then necessary, once the deposition of the desired material has been effected, to increase the temperature of the workpiece up to about 540.degree. C. to destroy and, hence, to eliminate the protective material.
A method for depositing a layer of a material on at least one area of the surface of a substrate, said method comprising the steps of:
A method for depositing a layer of a material on at least one area of the surface of a substrate said deposition being provided at a temperature of at least 300.degree. C., said method comprising the steps of:
A method of depositing a layer of a material on at least one area of the surface of a substrate said deposition being performed at a temperature of at least 300.degree. C., said temperature corresponding to the beginning of the softening of said substrate, said method comprising the steps of:
Dependencies are inferred from the claim text.