Method of forming printed circuit
AssigneeTokyo Shibaura Denki Kabushiki Kaisha
InventorsKunihiro Ikari, Katsuhiro Takahashi, Kazuhiro Takeda
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Abstract
A printed circuit is formed by a coating the entire region of at least one main surface of an insulating substrate with a resin type adhesive layer containing a solid solution consisting of titanium oxide, nickel oxide and antimony oxide, followed by selectively forming a mask on the adhesive layer to provide the non-masked region as a circuit-forming region. Further, the circuit-forming region is treated with a solution of an oxidizing agent and, then, subjected to an activation treatment. Finally, the mask is removed and a desired conductive layer pattern is formed on the activated surface region by means of electroless plating.
Claims15
A method of forming a printed circuit comprising the steps of:
- forming on the entire region of at least one main surface of an insulating substrate a resin type adhesive layer containing a solid solution consisting of titanium oxide, nickel oxide and antimony oxide;
- selectively forming a mask on the adhesive layer to provide the non-masked region as a circuit-forming region;
- treating the surface of the circuit-forming region with a solution of an oxidizing agent;
- activating the surface region treated with the oxidizing agent;
- removing the mask;
- and
- forming a desired conductive pattern layer on the activated surface region by means of electroless plating.
Dependencies are inferred from the claim text.