Copper coating composition for shielding electronic equipment and the like

A new coating composition, suitable for use as a copper shielding coating that maintains high electrical conductivity and for other applications requiring good electrical conductivity,

• said composition being comprised of,
• (a) a pigment material substantially of copper and being selected from at least one of the group consisting of electrical grade copper or copper alloys,
• said pigment being finely particulated and having a particle size of less than about 200 microns,
• (b) a binder resin which is selected from at least one of the group consisting of thermoplastic acrylic, vinyl, urethane, alkyd, polyester, hydrocarbon, fluoroelastomer, and cellulosic resins, and thermosetting acrylic, polyester, epoxy, urethane and alkyd resins,
• the pigment to binder weight ratio in said composition being between about 20 to 1 and about 2 to 1,
• (c) an organic titanate material means of a pyrophosphate type for providing good heat stability to the coating as applied on a substrate, and enabling the coating to maintain good electrical conductivity during sustained exposure to elevated temperatures,
• said organic titanate being present in amount of about 1/2% to about 18% by weight of said pigment material,
• (d) and, an organic solvent carrier for the composition, said composition containing a weight percent total solids within a range of about 20% to about 85%.