Methods of depositing metallic copper on substrates
AssigneeWestern Electric Company, Inc.
InventorsWilliam M. Beckenbaugh, Theodore D. Polakowski, Jr., Donald Dinella, Patricia J. Goldman
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AssigneeWestern Electric Company, Inc.
InventorsWilliam M. Beckenbaugh, Theodore D. Polakowski, Jr., Donald Dinella, Patricia J. Goldman
Estimating the term…
In an improved method for depositing a metal on a substrate of the type in which a dielectric coated substrate is coated with a sensitizing solution containing a reductible metal salt, a primary reducing agent comprising 2,7 anthraquinone disulfonic acid and a secondary reducing agent, the substrate is exposed to ultraviolet light in an atmosphere having a temperature of at least 117.degree. F. (42.degree. C.) and a mass of water vapor of at least 3.8 mg of water per liter of dry air for at least 15 seconds. In an embodiment of the method the substrate is aerated in a moisture controlled atmosphere at room temperature for at least 30 minutes prior to exposing the substrate to ultraviolet light.
An improved method for depositing a metal on a substrate of the type in which a dielectric coated substrate is coated with a sensitizing solution containing a reductible metal salt, a primary reducing agent comprising 2, 7 anthraquinone disulfonic acid or an alkali metal salt thereof, and a secondary reducing agent, and in which the coated substrate is dried and thereafter exposed to ultraviolet radiation to form catalytic metal sites at regions where metal is to be deposited, wherein the improvement comprises:
The improved method as recited in any of the preceding claims wherein, prior to the exposing step, the substrate is aerated in an atmosphere having a temperature of at least 60.degree. F. and containing at least 2.6 milligrams of water per liter of dry air for at least 30 minutes.
An improved method for depositing a metal on a substrate, of the type in which a dielectric coated substrate is coated with a sensitizing solution containing a reducible metal salt of a non-noble metal, a primary reducing agent selected from the group consisting of 2,7 anthraquinone disulfonic acid, alkali metal salts of 2,7 anthraquinone disulfonic acid, and mixtures thereof, and a second reducing agent, and in which the coated substrate is dried and thereafter exposed to ultraviolet radiation to form catalytic metal sites at regions where metal is to be deposited, wherein the improvement comprises:
Dependencies are inferred from the claim text.